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The Transparent 830 Tie-points Solderless Plug-in Prototype Breadboard is ideal for building and testing electronic circuits without soldering. Here are its key features: • Tie-points: 830, offering ample space to prototype multiple components. • Material: Transparent plastic, allowing you to see through the board. • Connection: Solderless, meaning components can be inserted and removed easily. • Adhesive Backing: The breadboard has adhesive on the back, allowing it to stick securely to a surface or a project board. • Power Rails: Typically includes two power rails on the sides for convenient power distribution. • Compatibility: Ideal for use with components such as resistors, transistors, capacitors, and integrated circuits Read more
Product
specifications
·
Hole
Spacing: 0.1 inch, perfect for
standard-sized components.
·
Tie Points: 830 in total, organized into 63 rows and 10 columns, with
two sets of 5 columns for component connections.
·
Power Rails: Four power buses, each with 2 power rails (positive and
negative) on both sides, providing a total of 8 rails with 25 tie points each.
·
Numbered
Pins: Rows and columns are labeled with
numbers and letters for easy identification of connections.
·
Material: Low-static plastic body, safe for CMOS components.
·
Wire
Compatibility: Works with jumper wires and wire
gauges from 20 to 29 AWG.
·
DIP
Component Compatibility: A 0.3-inch
gap between sets of 5 columns allows for easy placement of dual in-line
packages (DIP).
·
Interlocking
Design: Multiple breadboards can be linked
together for larger projects.
·
Size: 6.5 inches (165.1 mm) in length and
2.125 inches (53.575 mm) in width.
| Specifications | Descriptions |
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